PLATON aims to be the first project that will realize Tb/s optical routing fabrics for optical interconnects in backplanes and BladeServers adopting plasmonics as its disruptive technological vehicle. Application of surface plasmon polaritons (SPPs) in nanophotonics is rapidly emerging as an effective means to guide and manipulate optical signals on subwavelength scale and below the diffraction limit of light. PLATON will exploit SPPs to develop the first ultra-compact Dielectric Loaded Surface Plasmon Polariton (DLSPP) switches capable to route real data for BladeServer and backplane optical interconnects with very small footprint (<15x40 µm2), consuming very low powers (<15mW) and exhibiting negligible latency lower than 250fsec. PLATON will use these switches as building blocks on a CMOS compatible SOI optical integration board to merge plasmonics, silicon nanophotonics and electronic ICs. As such PLATON will ideally blend the small size and low power switching capabilities of plasmonics with the low loss of silicon and processing capacity of electronics, to provide miniaturized and power efficient, Tb/s photonic interconnect routers for ultra-performance data communications. Towards fulfilling its goals, PLATON’s objectives include:
1. Fiber-pigtailing of plasmonic switching elements
2. Development of 2x2 DL-SPP thermooptic switches for routing applications
3. Development of a 4x4 thermooptic DL-SPP-based switching matrix for routing applications
4. 10- and 40Gb/s- WDM-packet-traffic routing with 2x2 and 4x4 DLSPP switches.
5. High-speed all-optical bitwise processing using a >10Gb/s plasmonic switch
6. Development of a Silicon-on-Insulator motherboard
7. Heterointegration of advanced plasmonics-silicon photonics-electronics structures
8. Towards 3D System-in-Package: Packaging and fiber-pigtailing of DLSPP/SOI/RF technological platform
9. Ultra-high capacity on-chip Tb/s plasmonic routing platform for BladeEnclosure and Backplane optical interconnects
Two high-capacity routing prototypes will be developed in order to prove the high-throughput and enhanced functionality of the plasmonics/photonics platform and to assess and verify the feasibility of the concept in scale:
- 2x2 routing platform with a total throughput of 560Gb/s, and
- a 4x4 routing platform with a total throughput of 960Gb/s
